2-331677-2 - TE

2-331677-2

TE
MIN Bauteil-Steckbu
RoHS compliant

Product Type Features

  • Sleeve Style:Open Bottom
  • Connector System:Cable-to-Board
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Product Type:Contact
  • Profile:Zero
  • Wire/Cable Type:Discrete Wire

Body Features

  • Sealant:No
  • Sleeve Plating Material:Tin
  • Sleeve Material:Copper

Contact Features

  • Contact Base Material:Beryllium Copper
  • Contact Current Rating (Max)(A):6.5
  • Contact Type:Socket
  • Contact Spring Plating Thickness:.762µm[30µin]
  • Contact Spring Plating Material:Gold
  • Contact Mating Area Plating Thickness:30µm[30µin]
  • Contact Transmits (Typical):Signal (Data)/Power
  • Socket Type:Discrete

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Press-Fit
  • Termination Method to Wire & Cable:Solder
  • Insertion Method:Hand/Semi-Automatic/Automatic

Dimensions

  • Socket Length:3.51mm[.138in]
  • Hole Size (Recommended):1.57mm[.062in]
  • Wire/Cable Size:.41 – .518mm²[20 – 21AWG]
  • Mating Pin Diameter Range:.76 – .84mm[.03 – .033in]
  • PCB Thickness (Recommended):.79 – 3.18mm[.031 – .125in]

Usage Conditions

  • Operating Temperature Range:-65 – 125°C[-85 – 257°F]

Operation/Application

  • Circuit Application:Power & Signal

Packaging Features

  • Packaging Method:Bag, Loose Piece
  • Packaging Quantity:2000

Other

  • Spring Material:Beryllium Copper
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available in 2 - 4 weeks
22.745
Standard lead time for additional quantities:
16 weeks
Order quantity (minimum 400)
quantity price/piece
400 0,34 €
900 0,34 €
1800 0,33 €
Do you need a larger quantity?

Product Type Features

  • Sleeve Style:Open Bottom
  • Connector System:Cable-to-Board
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Product Type:Contact
  • Profile:Zero
  • Wire/Cable Type:Discrete Wire

Body Features

  • Sealant:No
  • Sleeve Plating Material:Tin
  • Sleeve Material:Copper

Contact Features

  • Contact Base Material:Beryllium Copper
  • Contact Current Rating (Max)(A):6.5
  • Contact Type:Socket
  • Contact Spring Plating Thickness:.762µm[30µin]
  • Contact Spring Plating Material:Gold
  • Contact Mating Area Plating Thickness:30µm[30µin]
  • Contact Transmits (Typical):Signal (Data)/Power
  • Socket Type:Discrete

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Press-Fit
  • Termination Method to Wire & Cable:Solder
  • Insertion Method:Hand/Semi-Automatic/Automatic

Dimensions

  • Socket Length:3.51mm[.138in]
  • Hole Size (Recommended):1.57mm[.062in]
  • Wire/Cable Size:.41 – .518mm²[20 – 21AWG]
  • Mating Pin Diameter Range:.76 – .84mm[.03 – .033in]
  • PCB Thickness (Recommended):.79 – 3.18mm[.031 – .125in]

Usage Conditions

  • Operating Temperature Range:-65 – 125°C[-85 – 257°F]

Operation/Application

  • Circuit Application:Power & Signal

Packaging Features

  • Packaging Method:Bag, Loose Piece
  • Packaging Quantity:2000

Other

  • Spring Material:Beryllium Copper
No entries available.
No entries available.
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